| Layer Counts |
1 & 2 layers, multi-layer up to 8 layer & Aluminum PCB / Copper base PCB |
Maximum unit size
Minimum unit size |
521.4mm x 597.6mm
5.0mm x 5.0mm |
| Base Material |
XPC, 94HB, FR-1, FR-2, FR-4, CEM-1, CEM-3, Aluminum |
| Major Laminate Supplier |
ShengYi, Kingboard, Isola, HuaZheng New Material, Goldenmax |
| Board Thickness |
Paper Phenolic/CEM-1: 0.8 ~ 1.60mm
CEM-3/FR-4: 0.20 ~ 3.20mm |
| Finished Copper Thickness |
1 ~ 4oz. (35 ~ 140um) |
| Type of Finishing |
Entek Coating (OSP), Nickel Plating, Flash Gold Plating,
Flash Thick Gold Plating(up to 50u”),
Immersion Gold, Immersion Tin
Lead Free HASL
|
| Drill & Route |
CNC Machine |
| Min. Hole Size |
CNC Drill Type: 0.20mm (8mil)
Punched Type: 0.80mm (32mil) |
| Hoe Size Tolerance |
CNC Drill Type: +/-0.075mm (3mil)
Punched Type: +/-0.10mm (4mil) |
| Imaging Transfer |
Screen Printing & Dry Film |
| Min. Line Width & Spacing |
Screen Printing: 0.2mm (8mil)
Dry Film: 0.10mm (4mil) |
| Solder Mask |
UV Cure, Thermal Cure & LPI |
| Min. Solder Mask Clearance |
UV & Thermal Cure: 0.15mm (6mil)
LPI: 0.075mm (3mil)
|
| Min. Annular Ring |
UV & Thermal Cure: 0.15mm (6mil)
LPI: 0.075mm (3mil) |
| Extra Print |
Solder Mask Plug Hole
Peelable Solder Mask
Carbon Ink (inc. High Resistance) |
| Profile and V-cut |
CNC Routing, Punching, V-cut, Beveling |
